Diemat, Inc. | Thermally Conductive Adhesive Selection Guide

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THERMALLY CONDUCTIVE ADHESIVE SELECTION GUIDE

Adhesive Type	THERMOPLASTIC	THERMOPLASTIC / THERMOSET		THERMOSET						SILVER-GLASS
Product Name	DM4030LD/F890	DM4130SM/J147	DM4130HT/F892	DM6030Hk/F954	DM6030Hk/J110	DM6030Hk-PT/H579	DM6030Hk-SD/H937	DM6030SF/H822	Sk100SD-J182	DM3030/H974
TYPICAL PROPERTIES (Cured)	To view product data sheet, click on the product name
Thermal Cond. (W/m°K)	15	5	17	60	60	45	40	12	60	65
Bulk Resistivity (µW-cm)	42	100	22	8	9	9	12	28	7	13
Adhesion (psi) ^[1]	1000	2200^[5]	2200	3200	2800	2400	1700	4800	2300	600^[3]
Flexural Modulus (kpsi)	85	200	175	600	600	500	500	800	600	350^[4]
Thermal Expansion (ppm/°C)	28	30	30	26	26	26	26	35	26	20
Rework Temperature (°C) ^[2]	120	150	150	N/A	N/A	N/A	N/A	N/A	N/A	N/A
	^[1] die shear - 0.250" bare ceramic die ^[2] 10 psi force ^[3] tensile - 0.400" bare ceramic die ^[4] Young's modulus ^[5] die shear – 0.100" bare ceramic die
FEATURES
High Thermal Conductivity
Low Stress
Reworkability
High Temp. Adhesion
Stable Contact Resistance
One Step Cure
Room Temp. Stability
Withstands 350 C Package Sealing


TYPICAL APPLICATIONS	DM4030LD/F890	DM4130SM/J147	DM4130HT/F892	DM6030Hk/F954	DM6030Hk/J110	DM6030Hk-PT/H579	DM6030Hk-SD/H937	DM6030SF/H822	Sk100SD-J182	DM3030/H974
General Die Bonding
High k Interface
High Power
Large CTE mismatch
Large Area Attach
Direct Bond to Metal
High Temp. Wire Bond
Multichip Modules
Hybrids
Chip-on-Board
Surface Mount Passives
Automotive
Hi Rel. / Military

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