THERMALLY CONDUCTIVE ADHESIVE SELECTION GUIDE

Adhesive Type THERMOPLASTIC THERMOPLASTIC / THERMOSET THERMOSET SILVER-GLASS
Product Name 4030LD 4030SM 4130SM 4130HT 4131HT 5030P 5130P 6030Hk 6030Hk-PT 6030Hk-SD 6030SF        3030       
TYPICAL PROPERTIES (Cured) To view product data sheet, click on the product name
Thermal Cond. (W/m°K) 15 10 5 17 18 25 27 60 45 50[5] 12 65
Bulk Resistivity
(µW-cm)		 42 70 100 22 48 29 27 8 9 12 28 13
Adhesion
(psi) [1]		 1000 1500[6] 2200[6] 2200 2000 2000 2400 3200 2400 1700 4800 900[3]
Flexural Modulus
(kpsi)		 85 100 200 175 175 300 400 600 500 500 800 350[4]
Thermal Expansion
(ppm/°C)		 28 30 30 30 30 23 23 26 26 26 35 20
Rework Temperature
(°C) [2]		 120 120 150 150 150 N/A N/A N/A N/A N/A N/A N/A
[1] die shear - 0.250" bare ceramic die     [2] 10 psi force     [3] tensile - 0.400" bare ceramic die     [4] Young's modulus     [5] Preliminary     [6] die shear – 0.100" bare ceramic die
FEATURES
High Thermal Conductivity X X X X X X X X X
Low Stress X X X X X
Reworkability X X X X X
High Temp. Adhesion X X X X X X X X X
Stable Contact Resistance X X
One Step Cure X X X X X X X X X X X X
Room Temp. Stability X X X X X X X X X X X X
Withstands 350 C Package Sealing X
TYPICAL APPLICATIONS 4030LD 4030SM 4130SM 4130HT 4131HT 5030P 5130P 6030Hk 6030Hk-PT 6030Hk-SD 6030SF        3030       
General Die Bonding X X X X X X X X X
High k Interface X X X X X X X X X
High Power X X X X X X X X X
Large CTE mismatch X X X X X X X
Large Area Attach X X X
Direct Bond to Metal X X X X X X X X
High Temp. Wire Bond X X X X X X
Multichip Modules X X X X X X X X
Hybrids X X X X X X X X X X X
Chip-on-Board X X X X
Surface Mount Passives X X
Automotive X X X X X X X X X X
Hi Rel. / Military X X X X X X

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