THERMALLY CONDUCTIVE ADHESIVE SELECTION GUIDE

Adhesive Type THERMOPLASTIC THERMOPLASTIC / THERMOSET THERMOSET SILVER-GLASS
Product Name          Sk30N                Sk60N       Sk70N-J189   Sk70N-J202     Sk100N     Sk100SDN   Sk100SFN      DM3030/H974         DM3130/J185    
TYPICAL PROPERTIES (Cured) To view product data sheet, click on the product name
Thermal Cond. (W/m°K) 49 45 TBD TBD 55 62 9 65 65
Bulk Resistivity
(µW-cm)		 12 13 TBD TBD 9 10 42 13 13
Adhesion
(psi) [1]		 2670 3500 TBD TBD 1365 2300 3150 700[3] 900[3]
Storage Modulus
(kpsi)		 1404 1114 TBD TBD 1552 1425 1784 350[4] 350[4]
CTE Alpha1/Alpha2
(ppm/°C)		 30/22 31/23 TBD TBD 18/22 20/26 30/82 20 20
Rework Temperature
(°C) [2]		 120 150 TBD TBD N/A N/A N/A N/A N/A
[1] die shear - 0.200" Si die     [2] 10 psi force     [3] tensile - 0.400" bare ceramic die     [4] Young's modulus      
FEATURES
High Thermal Conductivity X X X X X X X X
Low Stress X X X
Reworkability X X X
High Temp. Adhesion X X X X X X X
Stable Contact Resistance X
One Step Cure X X X X X X X X X
Room Temp. Stability X X X X X X X X X
Withstands 350 C Package Sealing X X
TYPICAL APPLICATIONS          Sk30N                Sk60N       Sk70N-J189   Sk70N-J202     Sk100N     Sk100SDN   Sk100SFN      DM3030/H974         DM3130/J185    
General Die Bonding X X X X X X X X X
High k Interface X X X X X X X X X
High Power X X X X X X X X
Large CTE mismatch X X X X
Large Area Attach X X X X
Direct Bond to Metal X X X X X X X
High Temp. Wire Bond X X X X X X
Multichip Modules X X X X X X X X X
Hybrids X X X X X X X X
Chip-on-Board X X X X X X X
Surface Mount Passives X
Automotive X X X X X X X
Hi Rel. / Military X X X   X X

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