Diemat, Inc. | Diemat Thermal Adhesives vs. Competing Technology

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DIEMAT THERMAL ADHESIVES vs. COMPETING TECHNOLOGY

	DM4030 Series	DM5030 Series	DM6030 Series	Typical Thermally Conductive Epoxy
DESCRIPTION	Thermoplastic & TP/TS powders Non-reactive solvents	Thermosetting & TS/TP powders Non-reactive solvents	Thermosetting epoxy resin Non-reactive solvents	Epoxy resin with reactive diluents
THERMAL COND. (W/m°K)	5-20	25-30	12-60	1-3
RESISTIVITY (µW-cm)	30-250	25-30	5-40	100-200
ADHESION (Kg/cm²)	50-180	140-170	150-300	>150
FLEXURAL MODULUS (kpsi)	85-200	300-400	500-800	>600
REWORKABILITY (°C)	120-150	N/A	N/A	N/A
RHEOLOGY	High Thixotropic	High Thixotropic	Medium Thixotropic	Low Thixotropic
PASTE SHIPMENTS*	Ambient No Dry Ice	Ambient No Dry Ice	Ambient No Dry Ice	Dry Ice
STORAGE*	Room Temperature Jar Rolling preferred	Room Temperature Jar Rolling preferred	Room Temperature Jar Rolling preferred	Refrigeration -40°C typical
*For Diemat adhesives, comments apply to jar packaging.			TP = Thermoplastic
-40°C syringe packaging available on request.			TS = Thermoset

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DM4030 Series

DM5030 Series

DM6030 Series

Typical Thermally Conductive Epoxy