Diemat, Inc. | Diemat Thermal Adhesives vs. Competing Technology

This site requires JavaScript in order to display its navigation menu.
Please turn on JavaScript using one of the methods below:

For PC Internet Explorer users:
Select 'Internet Options' from 'Tools' menu. On 'Security' tab click the 'Custom Level...' button.
Select 'Medium' from the Reset menu, then click the 'Reset' button

For PC Firefox users:
Select 'Options' from the 'Tools' menu. On the 'Web Features' tab, check 'Enable JavaScript'

For Mac Safari users:
Select 'Preferences' from the 'Safari' menu. On the 'Security' tab, check 'Enable JavaScript'

For Mac Firefox users:
Select 'Preferences' from the 'Firefox' menu. On the 'Web Features' tab, check 'Enable JavaScript'

For Mac Internet Explorer users:
Select 'Preferences' from the 'Explorer' menu. Click on 'Web Content,' then select 'Enable scripting'

DIEMAT THERMAL ADHESIVES vs. COMPETING TECHNOLOGY

	Sk30N & Sk60N	Sk70N Series	Sk100N Series	Typical Thermally Conductive Epoxy
DESCRIPTION	Thermoplastic & TP/TS powders Non-reactive solvents	Thermosetting epoxy resin Non-reactive solvents	Thermosetting epoxy resin Non-reactive solvents	Epoxy resin with reactive diluents
THERMAL COND. (W/m°K)	45	TBD	9-62	1-3
RESISTIVITY (µW-cm)	12	TBD	9-42	100-200
ADHESION (Kg/cm²)	185-245	TBD	188-247	>150
STORAGE MODULUS (kpsi)	1110-1400	TBD	1425-1780	>600
REWORKABILITY (°C)	120-150	N/A	N/A	N/A
RHEOLOGY	High Thixotropic	Medium Thixotropic	Medium Thixotropic	Low Thixotropic
PASTE SHIPMENTS*	Ambient No Dry Ice	Ambient No Dry Ice	Ambient No Dry Ice	Dry Ice
STORAGE*	Room Temperature Jar Rolling preferred	Room Temperature Jar Rolling preferred	Room Temperature Jar Rolling preferred	Refrigeration -40°C typical
*For Diemat adhesives, comments apply to jar packaging.			TP = Thermoplastic
-40°C syringe packaging available on request.			TS = Thermoset

| |

Sk30N & Sk60N

Sk70N Series

Sk100N Series

Typical Thermally Conductive Epoxy