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THERMAL PROPERTIES OF SEMICONDUCTOR AND MICROELECTRONIC PACKAGING MATERIALS
Note: This data is approximate,
as material properties depend on composition and structure, operating temperature
range, processing dynamics, and other factors.
Material Coefficient of Thermal Expansion Bulk Thermal Conductivity
CTE k
ppm/°C
W/m°K
Semiconductors
AlGaAs
5.2
90
GaAs
5.7 to 6.9
46 to 55
GaN
3.2 to 5.6
40 to 130
Ge
5.8 to 5.9
58 to 60
InP
4.5
68
Si
2.5 to 4.2
140 to 163
SiC
4.0 to 5.8
16 to 55
SiGe
5.2
13
Metals, Alloys, and Composites
Alloy 42
4.0 to 5.2
11
AlSi
7 to 17
120 to 170
AlSiC
6 to 16
170 to 180
Aluminum
23 to 24
180 to 237
Brass
20
119 to 151
Copper
16.6 to 17.6
391 to 400
CuMo
6.3 to 6.6
160 to 184
CuW, 15/85
6.5 to 7.2
167 to 180
Inconel 625
7
10
Invar
1 to 2
10
Kovar
5.2 to 5.9
17
Molybdenum
5.1 to 5.2
139 to 140
Nickel
13.3 to 14
90
Silver
19 to 20
406 to 429
Stainless steel
10 to 19
18 to 27
Titanium & alloys
8 to 13
16
Tungsten
4 to 4.5
173
Ceramics
Aluminum Nitride
4.2 to 5.3
180 to 280
Alumina
5.7 to 8.1
20 to 30
Beryllia
8 to 9
230 to 298
Boron Nitride
8
250 to 300
LTCC
5 to 7
3
Sapphire
6.7
24
Organics and Carbon-based
BT
12 to 17
0.2
Diamond
1.0 to 3.8
1000 to 2000
FR-4
11 to 22
0.1
Graphite
2 to 3
10 (through thickness); 150 (in-plane)
LCP
0 to 40
0.3
Polyimide
6 to 60
0.1 to 0.2
Solders
AuSi, 97/3
10 to 13
285
AuSn, 80/20
16
57
SnPb, 63/37
25
36 to 50