Diemat, Inc. | DM6030Hk

This site requires JavaScript in order to display its navigation menu.
Please turn on JavaScript using one of the methods below:

For PC Internet Explorer users:
Select 'Internet Options' from 'Tools' menu. On 'Security' tab click the 'Custom Level...' button.
Select 'Medium' from the Reset menu, then click the 'Reset' button

For PC Firefox users:
Select 'Options' from the 'Tools' menu. On the 'Web Features' tab, check 'Enable JavaScript'

For Mac Safari users:
Select 'Preferences' from the 'Safari' menu. On the 'Security' tab, check 'Enable JavaScript'

For Mac Firefox users:
Select 'Preferences' from the 'Firefox' menu. On the 'Web Features' tab, check 'Enable JavaScript'

For Mac Internet Explorer users:
Select 'Preferences' from the 'Explorer' menu. Click on 'Web Content,' then select 'Enable scripting'

DM6030Hk

DESCRIPTION

The DM6030 products are silver-loaded epoxy adhesives with high thermal and electrical conductivity. A unique, patented organic system enables high filler loading of Ag powder/flake combinations. This technology provides a highly conductive polymer matrix when cured, which yields excellent thermal transfer properties. Unlike typical epoxy systems, all DM6030 products can be shipped and stored at room temperature. All DM6030 products are lead (Pb) free and RoHS compliant. The various family members have properties optimized specifically for different applications. With a k higher than most solders, DM6030Hk can replace metallic solder die attach. DM6030Hk-PT has slightly lower k but superior pin-transfer characteristics, including slower dryout tendency and lower thixotropy. DM6030SF is solvent-free, allowing environment-friendly processing and very long staging time while eliminating cure-induced shrinkage and outgassing.

[ View full version in Adobe PDF ]

Open

| |