Diemat, Inc. | DM6030Hk-SD

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DM6030Hk-SD

DESCRIPTION

The DM6030 adhesives are silver-loaded epoxies with high thermal and electrical conductivity. DM6030Hk-SD/H937 is a new product designed specifically for very small dice and applications such as LED attachment. The product has been formulated to have an exceptional resistance to drying out when dispensing and attaching large arrays of dice. It has also been formulated to resist resin bleed-out prior to curing.

The other unique properties of high thermal and electrical conductivity of the standard DM6030Hk are retained by the same patented organic system with high filler loading of silver powder/flake combinations. Processing parameters remain unchanged. This technology provides a highly conductive polymer matrix when cured with a k greater than most solders. Unlike typical epoxy systems, the DM6030Hk-SD/H937 product can also be shipped and stored at room temperature.

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