Diemat, Inc. | DM6030Hk-PT

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DM6030Hk-PT

DESCRIPTION

The DM6030 products are silver-loaded epoxy adhesives with high thermal and electrical conductivity. A unique, patented organic system enables high filler loading of Ag powder/flake combinations. This technology provides a highly conductive polymer matrix when cured, which yields excellent thermal transfer properties. Unlike typical epoxy systems, all DM6030 products can be shipped and stored at room temperature. The various family members have properties optimized specifically for different applications. With a k higher than most solders, the DM6030Hk can replace metallic solder die attach. The DM6030Hk-PT has slightly lower k but superior pin-transfer characteristics, including slower dryout tendency and lower thixotropy. The DM6030SF is solvent-free, allowing environment-friendly processing and very long staging time while eliminating cure-induced shrinkage and outgassing.

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