Diemat, Inc. | DM5130P

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DM5130P

DESCRIPTION

The DM5130P is a silver loaded polymeric adhesive specifically designed for high temperature wire bonding applications (>230°C) in high power, plastic molded packages. The adhesive component of the DM5130P is a 100% non-epoxy, thermosetting resin. It was designed to overcome some of the moisture absorbing characteristics inherent with most epoxy resins while retaining the high adhesion properties of thermosetting adhesives. When cured, a highly conductive polymer matrix yields excellent thermal transfer properties, matching or exceeding typical soft solder die attach performance.

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