Diemat, Inc. | DM5030P

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DM5030P

DESCRIPTION

DM5030P/H888 and DM5030P/F701C are silver-loaded polymeric adhesives designed for high-temperature wire-bonding applications (>230 °C). The adhesive component of DM5030P is an interpenetrating network (IPN) of thermoplastic and thermoset resins. Pure thermoplastic resins do not provide high-temperature adhesion necessary for high wire-bonding temperatures. Pure thermoset resins are generally too stressful for larger die attach on metal heat spreaders. An IPN of the two types of polymers provides the higher temperature adhesions for wire bonding, without creating excessive stress on the die. When cured, a highly conductive polymer matrix yields excellent thermal transfer properties, matching or exceeding typical soft solder die attach performance. DM5030P/H888 has improved moisture resistance compared to DM5030P/F701C.

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