The DM4140k2 is an electrically insulating, thermally conductive adhesive filled
with ceramic powders in an interpenetrating network of a thermoplastic and thermoset
polymer blend. This product is designed to provide a tough, yet resilient adhesive
bond for highly mismatched expansion components. The thermoplastic component of
the polymer blend allows for reworking at a relatively low temperature. Thin, void free
bondlines allow maximum thermal transfer.