Diemat, Inc. | DM4131HT

This site requires JavaScript in order to display its navigation menu.
Please turn on JavaScript using one of the methods below:

For PC Internet Explorer users:
Select 'Internet Options' from 'Tools' menu. On 'Security' tab click the 'Custom Level...' button.
Select 'Medium' from the Reset menu, then click the 'Reset' button

For PC Firefox users:
Select 'Options' from the 'Tools' menu. On the 'Web Features' tab, check 'Enable JavaScript'

For Mac Safari users:
Select 'Preferences' from the 'Safari' menu. On the 'Security' tab, check 'Enable JavaScript'

For Mac Firefox users:
Select 'Preferences' from the 'Firefox' menu. On the 'Web Features' tab, check 'Enable JavaScript'

For Mac Internet Explorer users:
Select 'Preferences' from the 'Explorer' menu. Click on 'Web Content,' then select 'Enable scripting'

DM4131HT

DESCRIPTION

DM4131HT/H548 is a modification of DM4130HT/F892, featuring higher thermal conductivity and excellent adhesion to aluminum. DM4131HT, through the use of a unique polymer blend, allows for reworkability as well as initial processing at temperatures as low as 175 °C yet still providing sufficient adhesion at elevated temperatures for applications with high operating temperatures. This polymer blend combined with a patented solvent system gives the DM4131HT excellent adhesion to most substrates including aluminum, low modulus for less die stress, and short processing times. DM4131HT provides thin, void-free films with thermal conductivity comparable to solder.

[ View full version in Adobe PDF ]

Open

| |