Diemat, Inc. | DM4130HT

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DM4130HT

DESCRIPTION

DM4130HT is a silver-loaded thermoplastic/thermoset adhesive designed for semiconductor bonding. The polymeric content of DM4130HT is an interpenetrating network (IPN) of thermoplastic and thermoset resins. This unique polymer blend provides high temperature adhesion for wire bonding without creating high stress on the component. DM4130HT forms thin, void-free films with thermal conductivities much higher than typical silver-loaded polymeric materials and approaching those of metallic solders. DM4130HT’s modulus is relatively low, so it can bond fairly large components, including chips, carriers and submounts, without excessive stress.

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