Diemat, Inc. | DM4030LD

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DM4030LD

DESCRIPTION

DM4030LD is a silver-loaded thermoplastic paste designed to attach large semiconductor devices, heat sinks, and/or substrates. DM4030LD provides a low stress, resilient bond for large-area, highly-mismatched materials. Due to a patented polymer/solvent system, DM4030LD can be processed at temperatures as low as 150–175°C yet still give void-free, thin bondlines to maximize thermal transfer. DM4030LD is easily reworked and will not harden or become brittle with time because of its unique thermoplastic nature. High silver loading and excellent particle-to-particle contact result in a high thermal conductivity of 15 W/m°K. DM4030LD/H887 is a new version with stable adhesion after pressure-cooker testing.

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