Diemat, Inc. | DM4000 B Stage Pastes

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DM4000 B Stage Pastes

DESCRIPTION

The DM4000B Series B-stageable Adhesive Pastes (DM4030B and DM4130B) represent the first two members of a series of silver-loaded, high thermal adhesive pastes designed for applications involving the attachment of large area, CTE-mismatched components. They complement Diemat’s DM4030LD and DM4130HT wet die attach pastes for use on larger area interfaces where solvent extraction is more difficult. The DM4000B Series materials are first applied to one component surface and partially cured removing all solvents. The other component is mated to the first with pressure and temperature to make the interfacial bond of low thermal resistance and low stress.

The products are based on either thermoplastic polymers or combinations of thermoplastics and thermosets. Some are designed to withstand higher temperature wire bonding or solder reflow. The unique organic system used in these B-Stage Pastes allows for fast removal of the solvent resulting in a void-free, smooth adhesive film. They melt at low temperatures for heat sensitive components and have a very low modulus giving a stress-free adhesive bond. The DM4000B pastes can be tailored for stenciling, screen printing or dispensing.

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