Diemat, Inc. | DM2995P/J204

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DM2995P/J204

DESCRIPTION

DM2995P/J204 low temperature lead-free sealing glass paste is designed to hermetically seal low thermal expansion materials such as silicon, alumina, Kovar, borosilicate and soda lime glasses at temperatures as low as 500 °C. It allows for thinner, uniform bondline thicknesses in certain applications. The paste comprises a low temperature lead-free glass powder loaded in a unique organic system which burns out completely during glazing. DM2995P/J204 paste can be screen-printed, stencil-printed or dispensed. It is glazed to the substrate at 500 °C. The glazed surface is mated to the other component under slight pressure and fired at a peak temperature ranging from 480 to 500 °C for as little as 1 minute to achieve a reliable, hermetic seal.

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