FREQUENTLY ASKED QUESTIONS


THERMAL ADHESIVES

How do I select the correct NAMICS adhesive for my application?
There are several important key factors involving the selection and processing of Diemat resin-based conductive adhesives.
These include:
  • The component materials being bonded to each other and any plating that is on the bonding surfaces.
  • The difference in coefficient of thermal expansion (CTE mismatch) between the two materials being bonded together.
  • The die size and bondline dimensions (length x width x thickness).
  • The thermal and electrical conductivity requirements.
  • Constraints on processing, including dispensing or other application method, placement delay, staging time, and curing time and temperature.
  • In-service performance and reliability requirements.
  • Rework requirements, if any.
Our Products By Application page lists and compares adhesive properties and applications.

How do I process NAMICS conductive adhesives?
In order to effectively evaluate these products, they must be processed according to the guidelines presented in each of their respective Product Data Sheets. It is most important that the recommended ramp rates and hold times and temperatures for each product are followed. Otherwise, improper curing or voiding might occur and the result could be inferior performance. Many of our data sheets provide up to three different options for curing profiles. Each one gives a peak temperature, a hold time range and ramp rate range for curing the product. Each data sheet also provides specific application information such as storage, handling and dispensing of the paste, and how much paste to apply (in milligrams per square inch and microliters per square inch of bond area).

Most of our products contain solvents (non-reactive diluents), so optimum curing is accomplished by using an oven or furnace with forced air convection and proper ventilation, as well as adhering to the profile recommendations mentioned above. It is also important that the oven or furnace is calibrated for that particular operation. This is accomplished by attaching a thermocouple to the actual part, and monitoring the curing profile with a chart recorder. This is recommended because the oven temperature often does not represent the actual part's temperature. The oven can then be adjusted accordingly. After the curing profile has been completed, the parts are allowed to cool to room temperature. Maximum properties develop following overnight room temperature equilibration of the cured, adhesive-bonded assembly.

GLASS PREFORMS

Why would I want to switch from solder in sealing our fibers?
Most importantly, metallization of the fiber is not required for sealing as it is for soldering. Thus, costs are greatly reduced. Reliability is also improved. Assembled and sealed parts have passed Telcordia's GR-468 specification.

HOME | TOP OF PAGE | SITE MAP