Diemat, Inc. | Solder Replacement in SMT Using Innovative Thermoplastic Conductive Adhesive

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SOLDER REPLACEMENT IN SMT USING INNOVATIVE THERMOPLASTIC CONDUCTIVE ADHESIVE

ABSTRACT

Conductive adhesive alternatives to Tin/Lead soldering have mainly concentrated on isotropic silver filled epoxy resins. These THERMOSETTING polymers do not offer a universally successful solution and this may be fundamental to the use of epoxy itself.

Another route being developed in a joint programme between MULTICORE SOLDERS LTD and DIEMAT INC. is based on THERMOPLASTIC polymers and offers benefits in the areas of reworkability, low modulus, low joint stress and possibly environmental stability. The novel process for compounding with silver can produce an order of magnitude improvement in electrical and thermal conductivity compared to typical epoxy/silver formulations and initial environmental reliability data demonstrates compatibility with Tin/Lead coated components and board finish.

A current application is outlined where a Hi-Rel silicon on silicon Hybrid (MCM) is realised using the Silver/Thermoplastic adhesive for both semiconductor die and passive chip components.

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