Diemat, Inc. | Interfacial Thermal Resistance Method of Measurement and Impact of Adhesive

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INTERFACIAL THERMAL RESISTANCE METHOD OF MEASUREMENT AND IMPACT OF ADHESIVE

ABSTRACT

This paper presents the experimental results for the interfacial thermal resistance of two components bonded with polymer adhesives of different chemistries. The interfacial resistances of a new family of high k conductive adhesives are compared with an industry standard lower k adhesive. Also described is the methodology for isolating and determining interfacial resistance. This determination was achieved by an adaptation of the laser-flash method described by Lee & Taylor [3]. A laser flash was directed on the surface of one component of the bonded assembly and the transient temperature was measured on the other component surface by an IR detector. Results using this technique were compared to the more industry standard thermal chip method of measuring TJC. A major portion of the total thermal resistance of the bonded composite was shown to occur at its interfaces. This method of measuring thermal interfaces should be a valuable tool for the thermal design engineer to more accurately predict the peak temperatures in thermal modeling.

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