Diemat, Inc. | High Thermal Conductivity in Organic Adhesives

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HIGH THERMAL CONDUCTIVITY IN ORGANIC ADHESIVES

ABSTRACT

Present day organic adhesives, which consist primarily of silver-loaded thermoset materials, have a fundamental limitation in thermal conductivity of about 3 W/mK. This thermal conductivity does not meet all the current demands of thermally enhanced plastic laminated packages, multichip modules, heat sink attach, or direct die attach to heat sinks or heat spreaders.

Our paper describes the design and optimization of a silver-loaded thermoplastic adhesive with a thermal conductivity as high as 35 W/mK, an order of magnitude higher than the 3 W/mK barrier of present organic adhesives. The design phase isolates and investigates the impact of each key variable on the thermal conductivity property. These variables include the polymer chemistry, size/shape of filler particles, and volume percent of the filler. High thermal conductivities without large sacrifices in functional properties are shown to be possible by optimization of the key variables through design of experiment matrices. A property summary of the new, thermally enhanced thermoplastic adhesive is compared with other typical organic attachment materials.

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