Diemat, Inc. was founded in 1988
by Raymond Dietz, who has over 40 years of experience in the electronic
materials industry serving in different capacities of development, marketing,
and general management. Mr. Dietz is the holder of over 25 patents in this
field.
Located in Byfield, Massachusetts, 30 miles north of Boston, Diemat specializes
in the development and manufacturing of innovative adhesive and sealing
materials to serve the electronic packaging industry. As a technology driven
company, only patentable products are marketed. The company is staffed with
professionals having expertise in Chemical Engineering, Polymer Chemistry,
Materials Science, and Semiconductors. This group has developed a broad
range of unique products, none of which have equivalents on the market.
Diemat products are available overseas through distributors, who are listed
in our sales directory.
In early 2008, Diemat was acquired by Namics Corporation. Namics is a leading
global source for high technology insulating and conductive materials. Namics
has served its worldwide customers since 1946 with enabling products for
leading edge applications and superior technical support. For more information
regarding this merger of technologies, feel free to download the press
release.
DIEMAT TECHNOLOGY
Since its inception, Diemat has developed and patented new generation materials, the first of which was a lower
temperature (300°C) Ag loaded glass adhesive for die attachment. This technology was patented and licensed to
Alpha Metals (Cookson group) and Quantum Materials (Henkel-Loctite). The low temperature glass technology is also
available in lead-free compositions.
Diemat has also developed, patented, and licensed a unique family of organic
adhesives offering thermal conductivity that is an order of magnitude greater
than the prior art. Unique polymer compositions and combinations of thermoplastic
and thermoset polymers are utilized. These provide "application specific"
products with widely ranging properties in modulus of elasticity, high temperature
adhesion, and reworkability.
More recently, Diemat developed a low temperature, solder-glass preform for hermetically sealing optical fibers in
optoelectronic packages. This technology replaces the more expensive soldering process, which requires fiber metallization.
This low temperature glass technology is also utilized in hermetically sealing lenses for the optoelectronic industry,
as well as hermetic sealing of package lids.
COMPANY CHARTER
Our charter is to provide the electronics
packaging industry with state-of-the-art products which offer better performance
and reliability at lower costs. To accomplish this, Diemat emphasizes developing
new products, expanding its customer service and manufacturing capabilities,
as well as its sales and distribution network.