Diemat, Inc. was founded in 1988 by Raymond Dietz, who has over 40 years of experience in the electronic materials industry serving in different capacities of development, marketing, and general management. Mr. Dietz is the holder of over 25 patents in this field.

Located in Byfield, Massachusetts, 30 miles north of Boston, Diemat specializes in the development and manufacturing of innovative adhesive and sealing materials to serve the electronic packaging industry. As a technology driven company, only patentable products are marketed. The company is staffed with professionals having expertise in Chemical Engineering, Polymer Chemistry, Materials Science, and Semiconductors. This group has developed a broad range of unique products, none of which have equivalents on the market.

In early 2008, Diemat was acquired by NAMICS Corporation. Namics is a leading global source for high technology insulating and conductive materials. Namics has served its worldwide customers since 1946 with enabling products for leading edge applications and superior technical support. For more information regarding this merger of technologies, feel free to download the press release.

On January 1, 2013 Diemat, Inc. became the NAMICS Corporation North American R&D Center.
Since its inception, Diemat has developed and patented new generation materials, the first of which was a lower temperature (300C) Ag loaded glass adhesive for die attachment. The low temperature glass technology is also available in lead-free compositions.

Diemat has also developed, patented, and licensed a unique family of organic adhesives offering thermal conductivity that is an order of magnitude greater than the prior art. Unique polymer compositions and combinations of thermoplastic and thermoset polymers are utilized. These provide "application specific" products with widely ranging properties in modulus of elasticity, high temperature adhesion, and reworkability.

In the late 1990's, Diemat developed a low temperature, solder-glass preform for hermetically sealing optical fibers in optoelectronic packages. This technology replaces the more expensive soldering process, which requires fiber metallization. This low temperature glass technology is also utilized in hermetically sealing lenses for the optoelectronic industry, as well as hermetic sealing of package lids.

In 2010 Diemat developed the next generation of thermally conductive adhesives, the Sk-series. The Sk-series adhesives use a unique silver filler technology (patent pending) yielding thermal conductivities upwards of 60 W/mK.
Our charter is to provide the electronics packaging industry with state-of-the-art products which offer better performance and reliability at lower costs. To accomplish this, Diemat emphasizes the development of new products.