Diemat, Inc. | The Leader in Thermally Conductive Adhesives and Low-Temperature Sealing Glasses

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OUR PRODUCT LINES

THERMALLY CONDUCTIVE ADHESIVES

NAMICS thermal adhesives include silver-filled epoxies with unmatched thermal conductivities, up to 60 W/m°K, exceeding most common solders. NAMICS thermoplastic and thermoset/thermoplastic adhesives are used to attach components with larger areas or thermal mismatches. Our silver-glass adhesives offer conductivity to 65 W/m°K and can withstand high processing and operating temperatures. NAMICS also offers thermally conductive, electrically insulating adhesives suitable for die bonding or heat sink attachment. Plating, flux, and atmosphere requirements of solder attach are eliminated when these adhesives replace solder.

Applications
» High-power semiconductor die attach » Power amplifiers » High-brightness LEDs » Laser diodes » Microprocessors » Large area, large CTE mismatch bonding	» Multi-Chip Modules / Hybrids » Chip-on-Board » Heat sink attach » High reliability / Military » Automotive » Solder Replacement

LOW-TEMPERATURE SEALING GLASS

NAMICS glasses are used to hermetically seal optical and semiconductor components without metallization. DM2700 glass seals at temperatures as low as 320 °C in a few seconds. For applications requiring higher operating or processing temperatures, DM2760 seals at 400 °C. DM2995 contains no lead (Pb) and seals at 500 °C. Diemat offers all these glasses in a wide range of preforms. Over 100 pre-tooled preform shapes are available from stock, and custom shapes can be tooled for a modest charge.
NAMICS preforms are widely used to seal optical fibers, lenses, windows, and lids in photonic and semiconductor devices and sensors. They replace solder seals at a fraction of the cost, with improved resistance to fatigue, creep, and corrosion. Plating, flux, and atmosphere requirements of solder attach can be eliminated.
DM2700 is also available in screen-printable frit paste form to seal lids, lenses and windows and to seal MEMS and other devices at the wafer level.

Applications
» Sealing of optical fibers in ferrules and tubes (preforms only) » Ribbon fiber sealing (preforms only) » Sealing lenses in holders or package wall » Hermetically sealed patch cords / pigtails	» Wafer bonding / wafer-level packaging » Package lid sealing » Via hole sealing » Sensor mounting and sealing

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